# ASE Technology Holding Co., Ltd. (ASX)

> Source: Nexqual · https://nexqual.com/ASX · data as of 2026-10-22 20:00 UTC · cite as "Nexqual, ASE Technology Holding Co., Ltd. (ASX), nexqual.com/ASX" · informational, not investment advice.

**Price:** USD 37.74 (-11.01% on the day) · last close of Oct 22, 2026; US market pre market, not a live price. Prev close 42.41 · day 37.28–40.21 · 52w 12.62–47.93 · market cap $83.0B · NYQ

## Key facts
- 1 of 80 tracked superinvestors hold ASX (13F, Q2 2026): 1 new, 0 added, 0 reduced, 0 unchanged.
- Analysts: Buy (mean 2.00 on a 1–5 scale) (1 analysts), mean target USD 58 (range 58–58).
- Total return with dividends: 1Y +197.3% vs S&P 500 +14.9%; 5Y +595.2% vs S&P 500 +80.3%.
- Next earnings: 2026-10-29, EPS estimate USD 0.36, revenue estimate $233B.

## Superinvestors (SEC 13F-HR, Q2 2026)
1 of 80 tracked investors hold ASX. Each row is the investor's latest 13F; change is vs their prior-quarter share count.
| Investor | Firm | % of portfolio | Value | Change |
|---|---|---|---|---|
| Lee Ainslie | Maverick Capital | 0.01% | $945K | New position |

## Analysts
Consensus Buy (mean 2.00 on a 1–5 scale), 1 analysts; mean target USD 58 (low 58, high 58).

## Total return (dividends reinvested)
|  | 1Y (from 2025-10-23) | 5Y (from 2021-10-18) |
|---|---|---|
| Total return | +197.3% | +595.2% |
| S&P 500 (SPY) | +14.9% | +80.3% |
| Per year | +198.5% | +47.2% |
| Volatility (annualized) | 57.9% | 38.8% |
| Max drawdown | -30.3% (Jun 2026→Jul 2026) | -35.5% (Jul 2024→Mar 2025) |

## Peers (Semiconductors)
NXPI (NXP Semiconductors N.V.) USD 237.79 -1.89% · MPWR (Monolithic Power Systems, Inc.) USD 1,167.93 -8.99% · UMC (United Microelectronics Corpora) USD 18.53 -6.51% · ALAB (Astera Labs, Inc.) USD 257.82 -11.11% · MCHP (Microchip Technology Incorporat) USD 74.52 -3.41% · STM (STMicroelectronics N.V.) USD 44.09 -7.04%

## More
Full page: https://nexqual.com/ASX · Free keyless MCP server with the same data and citations: https://mcp.nexqual.com/mcp · Guide for agents: https://nexqual.com/agents · https://nexqual.com/llms.txt

## Supply chain and relationships (SEC annual reports)

Named in ASX's own 20-F filed 2026-04-01 (https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm):

| Relationship | Company | Sentence in the filing |
|---|---|---|
| Supplier | TSMC (TSM) | "Since 1997, we have maintained a strategic alliance with Taiwan Semiconductor Manufacturing Company Limited, or TSMC, one of the largest dedicated semiconductor foundries in the world." |
| Supplier | SPIL | "SPIL offers a full range of packaging and testing solutions, including advanced packages, substrate packages and leadframe packages, as well as testing for logic and mixed signal devices." |
| Supplier | USI | "We expect to continue to combine our packaging, testing, and materials technologies with the expertise of USI Group at the systems level to develop our SiP business." |
| Supplier | Tokyo Electron | "We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research…" |
| Supplier | AMD (AMD) | "Examples of mergers and acquisitions by and among semiconductor packaging and testing companies include Jiangsu Changjiang Electronics Technology's acquisition of STATS ChipPAC, Nantong Fujitsu Microelectronics's acquisi…" |
| Supplier | Amkor Technology (AMKR) | "Examples of mergers and acquisitions by and among semiconductor packaging and testing companies include Jiangsu Changjiang Electronics Technology's acquisition of STATS ChipPAC, Nantong Fujitsu Microelectronics's acquisi…" |
| Supplier | Infineon | "For example, in 2023, we acquired HCC Group to expand our automotive wireless business, in 2024, we acquired Infineon Group's manufacturing subsidiaries in the Philippines and South Korea to expand power chip module pack…" |
| Supplier | Analog Devices (ADI) | "For example, in 2023, we acquired HCC Group to expand our automotive wireless business, in 2024, we acquired Infineon Group's manufacturing subsidiaries in the Philippines and South Korea to expand power chip module pack…" |
| Supplier | All Ring Tech | "We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research…" |
| Supplier | Grand Process Technology | "We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research…" |
| Supplier | Lam Research (LRCX) | "We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research…" |
| Supplier | TERADYNE, INC (TER) | "We purchase testers from major international manufacturers, primarily Teradyne, Inc., Tokyo Electron Limited, and Advantest Corporation." |

Other companies that name ASX in their own reports (relationship from ASX's side):

| Relationship | Company | Their filing | Sentence |
|---|---|---|---|
| customer | Credo Technology Group Holding Ltd (CRDO) | 10-K 2026-06-15 | "•Package, Assembly and Testing: Upon the completion of processing at the foundry, we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanc…" |
| customer | GSI TECHNOLOGY INC (GSIT) | 10-K 2026-06-05 | "All of our manufactured wafers, including wafers for our APU products, are tested for electrical compliance and most are packaged at Advanced Semiconductor Engineering ("ASE") which is located in Taiw…" |
| customer | SEQUANS COMMUNICATIONS (SQNS) | 20-F 2026-05-11 | "We currently rely on outsourced semiconductor assembly and test (OSAT) suppliers such as Advanced Semiconductor Engineering ChungLi (ASECL), Advanced Semiconductor Engineering, Inc. (ASEKH) and Silico…" |
| customer | Silicon Motion Technology CORP (SIMO) | 20-F 2026-04-30 | "We currently engage companies such as Siliconware Precision Industries Ltd. (SPIL), Powertech Technology Inc. (PTI), Advanced Semiconductor Engineering. (ASE), Orient Semiconductor Electronics Limited…" |
| competitor | CHIPMOS TECHNOLOGIES INC (IMOS) | 20-F 2026-04-14 | "Our competitors include large IDMs with in-house testing and assembly capabilities and other independent semiconductor assembly and testing companies, especially those offering vertically integrated a…" |
| partner | Ainos, Inc. (AIMD) | 10-K 2026-03-30 | "August 6, 2025, the Company entered into a three-year subscription-based agreement with ASE Technology Holding Co., Ltd. ("ASEH")," |
| customer | AMBARELLA INC (AMBA) | 10-K 2026-03-23 | "Samsung subcontracts the assembly and initial testing of the assembled chips it supplies to us to Signetics Corporation and STATS ChipPAC Ltd. In the case of purchases of tested die from Samsung, we c…" |
| competitor | AMKOR TECHNOLOGY, INC. (AMKR) | 10-K 2026-02-20 | "We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology." |
| customer | Astera Labs, Inc. (ALAB) | 10-K 2026-02-20 | "We use Advanced Semiconductor Engineering and Amkor Technologies to assemble, package, and test our ICs." |
| customer | LATTICE SEMICONDUCTOR CORP (LSCC) | 10-K 2026-02-13 | "All of our assembly and test operations are performed by industry-leading outsourced assembly and test suppliers ("OSATs") with our primary supplier being Advanced Semiconductor Engineering, Inc. ("AS…" |
| customer | SITIME Corp (SITM) | 10-K 2026-02-11 | "Upon the completion of processing at the foundry, we use third-party contractors for packaging, assembly, and testing, including Advanced Semiconductor Engineering, Inc. ("ASE") in Taiwan, Carsem (M) …" |
| customer | MAXLINEAR, INC (MXL) | 10-K 2026-01-29 | "The majority of our assembly/packaging and test requirements are supported by the following independent subcontractors: Advanced Semiconductor Engineering, or ASE, Greatek Electronics, Inc., Signetics…" |
| customer | QUALCOMM INC/DE (QCOM) | 10-K 2025-11-05 | "Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC." |

## Analyst estimates and revisions

| Period | EPS est. | 90d ago | Change | Revenue est. | Analysts |
|---|---|---|---|---|---|
| Current quarter (ends 2026-09-30) | $0.36 | $0.31 | +14.5% | $233.36B | 1 |
| Next quarter (ends 2026-12-31) | $0.38 | $0.36 | +4.6% | $244.83B | 1 |
| Current fiscal year (ends 2026-12-31) | $1.23 | $1.08 | +13.8% | $840.15B | 1 |
| Next fiscal year (ends 2027-12-31) | $2.15 | $1.99 | +7.7% | $1.05T | 1 |